Future Challenges and Roadmaps of Semiconductor, Packaging and Integration

More than 80% of all automotive innovations are directly or indirectly enabled by semiconductors. In recent years premium cars became an early adopter of new technologies to enable new customer functions. Nowadays automotive is even pushing new semiconductor and packaging technologies in some areas. The automotive megatrends continuously impose new challenges on semicondcutors and their package in performance, energy efficiency as well as in reliability and robustness. The presentation will introduce the automotive megatrends and explain the new challenges by practical examples. In addition it will be explained how the Audi semiconductor strategy, the Progressive SemiConductor Program (PSCP), addresses the challenges - synchronizing the development speed of semiconductors with the need for increased reliability.