Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology
This paper presents a novel ultra-compact System-in-Package (SiP) module with highly integrated wireless connectivity devices combining a set of 4 standards: WLAN, Bluetooth, FM and GPS. Besides an IC, the SiP module consists of RF filters, SMD components and a Single-Chip RF Front-end. The main IC...
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| Veröffentlicht in: | International Symposium on Microelectronics 2012-01, Vol.2012 (1), p.1131-1134 |
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| container_title | International Symposium on Microelectronics |
| container_volume | 2012 |
| creator | Sieroshtan, V. Sevskiy, G. Komakha, P. Aleksieiev, O. Burygin, A. Chayka, O. Ruban, O. Shevelov, M. Kato, K. Horibe, A. Fujioka, H. Ruffing, K. Heide, P. Vossiek, M. |
| description | This paper presents a novel ultra-compact System-in-Package (SiP) module with highly integrated wireless connectivity devices combining a set of 4 standards: WLAN, Bluetooth, FM and GPS. Besides an IC, the SiP module consists of RF filters, SMD components and a Single-Chip RF Front-end. The main IC is embedded inside the substrate and basics of SESUB technology are described. For electromagnetic compatibility and physical protection a metal EMI shield has been used. The total size of solution presented is 8.0×7.5×1.3mm3 demonstrating significant miniaturization over current module technology. The embedding process and SiP module routing has shown benefits in electrical and mechanical performance. |
| doi_str_mv | 10.4071/isom-2012-THP41 |
| format | Article |
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| ispartof | International Symposium on Microelectronics, 2012-01, Vol.2012 (1), p.1131-1134 |
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| language | eng |
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| source | Alma/SFX Local Collection |
| title | Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology |
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