Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology

Novel ultra-compact quad-band System-in-Package (SiP) module with IC embedded in substrate based on SESUB technology

This paper presents a novel ultra-compact System-in-Package (SiP) module with highly integrated wireless connectivity devices combining a set of 4 standards: WLAN, Bluetooth, FM and GPS. Besides an IC, the SiP module consists of RF filters, SMD components and a Single-Chip RF Front-end. The main IC...

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Veröffentlicht in:International Symposium on Microelectronics 2012-01, Vol.2012 (1), p.1131-1134
Hauptverfasser: Sieroshtan, V., Sevskiy, G., Komakha, P., Aleksieiev, O., Burygin, A., Chayka, O., Ruban, O., Shevelov, M., Kato, K., Horibe, A., Fujioka, H., Ruffing, K., Heide, P., Vossiek, M.
Format: Artikel
Sprache:eng
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Zusammenfassung:This paper presents a novel ultra-compact System-in-Package (SiP) module with highly integrated wireless connectivity devices combining a set of 4 standards: WLAN, Bluetooth, FM and GPS. Besides an IC, the SiP module consists of RF filters, SMD components and a Single-Chip RF Front-end. The main IC is embedded inside the substrate and basics of SESUB technology are described. For electromagnetic compatibility and physical protection a metal EMI shield has been used. The total size of solution presented is 8.0×7.5×1.3mm3 demonstrating significant miniaturization over current module technology. The embedding process and SiP module routing has shown benefits in electrical and mechanical performance.
ISSN:2380-4505
DOI:10.4071/isom-2012-THP41