System-on-Chip Integrated MEMS Packages for RF LNA Testing and Self-Calibration

In this paper, we present MEMS-enhanced integrated package design which provides the capability to self-test and self-calibrate integrated circuit chips. We have developed a novel test technique where the test stimulus is generated by modulating the RF carrier signal with another signal mixed with additive white Gaussian noise. This novel test stimulus is provided as the input to the RF circuit and the peak-to-average ratio (PAR) is measured at the output. Simulations were carried out for fault-free and fault-induced circuit conditions, and their corresponding PARs were stored in the look-up table (LUT). Test simulations were performed and the results were compared with the look-up table to verify whether the device is fault-free. In faulty circuit conditions, calibration was performed using a tuning circuit made of MEMS switches. The entire validation of the design using the test technique and self-calibration of the RF circuit was automated using the calibration algorithm. This testing and self-calibration technique is exhaustive and efficient for present-day communication systems.