ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications

ZoneBOND Thin Wafer Support Process for Wafer Bonding Applications

The ZoneBOND process has been developed as an alternative temporary bonding process that bonds at an acceptable temperature (usually less than 200°C), survives through higher-temperature processes, and then debonds at room temperature. The technology utilizes standard silicon or glass carriers and c...

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Veröffentlicht in:Journal of microelectronics and electronic packaging 2010-07, Vol.7 (3), p.138-142
Hauptverfasser: McCutcheon, Jeremy, Brown, Robert, Dachsteiner, JoElle
Format: Artikel
Sprache:eng
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Zusammenfassung:The ZoneBOND process has been developed as an alternative temporary bonding process that bonds at an acceptable temperature (usually less than 200°C), survives through higher-temperature processes, and then debonds at room temperature. The technology utilizes standard silicon or glass carriers and current thermoplastic adhesives developed by Brewer Science, Inc.
ISSN:1551-4897
DOI:10.4071/imaps.269