Ageing of Some Lacquers Due to Microbiological Stress

This paper shows the ageing study of some coatings and / or impregnation lacquers due to microbiological stress through fungal attack. Dielectric spectroscopy has shown that the dielectric losses of the investigated materials increase as result of microbiological ageing. The mean recorded increases are about 4 times for the alkyl-epoxy-melamine copolymer, 2 times for epoxy polymer and 1.5 times for urethane polymer in agreement with the mould coverage degree of about 20 %, 10 %, and 3 %, respectively. The fungal attack of the investigated polymers led to a decrease in volume resistivity of about 65 % for the alkyl-epoxy-melamine copolymer, 45 % for the epoxy polymer, and 14 % for polyurethane, in agreement with the increase of dielectric losses and degree of mold coverage of the samples. FTIR determinations have shown that fungal attack significantly increased the number of aliphatic -OH and C-H bonds and decreased the number of C-O bonds, respectively of C-O-C oxiran groups and C-C aromatic bonds. DSC thermograms recorded at different temperature ranges and the activation energies calculation for first major oxidation process indicate that after the fungal attack the thermooxidative reactivity of the investigated polymers increases.