L Shaped via based Mushroom type High Impedance Structure
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| Veröffentlicht in: | International Journal of Engineering 2019-04, Vol.6 (4), p.143-147 |
|---|---|
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| Format: | Artikel |
| Sprache: | eng |
| Online-Zugang: | Volltext |
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| container_end_page | 147 |
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| container_issue | 4 |
| container_start_page | 143 |
| container_title | International Journal of Engineering |
| container_volume | 6 |
| creator | Ahmad, Touseef |
| description | |
| doi_str_mv | 10.34259/ijew.19.604143147 |
| format | Article |
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| fulltext | fulltext |
| identifier | ISSN: 2521-2419 |
| ispartof | International Journal of Engineering, 2019-04, Vol.6 (4), p.143-147 |
| issn | 2521-2419 2409-2770 |
| language | eng |
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| source | EZB Electronic Journals Library |
| title | L Shaped via based Mushroom type High Impedance Structure |
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