ATTEMPT OF TARGET SLANTING ON FACING TARGETS SPUTTERING SYSTEM

The facing targets sputtering system (FTS) can prepare the Co-Cr and Fe-Ni-Cr films with high performance for perpendicular magnetic recording media because of the many advantages depending on the unique layout of targets and substrates. In this study, the improvements of the deposition rate and the distribution of film thickness have been attempted by slanting the targets. Then, the discharge characteristics have been investigated. However, in the case of a targets-slanted type, only a little increase of discharge current was observed for increasing the target voltage. These results could be attributed to the loss of the high energy secondary electrons which are confined between two targets in FTS system of normal layout. It was confirmed that two targets must be parallel to each other to confine the discharge plasma effectively and to deposit on the substrate at plasma free.