Registration of Tx3364 through Tx3407 Grain Weathering–Resistant Sorghum Germplasm

The sorghum [Sorghum bicolor (L.) Moench] germplasm lines Tx3364 through Tx3407 (Reg. No. GP‐793 to GP‐836, PI 669511 to PI 669554) were developed and released by Texas A&M AgriLife Research, Lubbock, TX, in 2013. Breeding crosses from most of these lines were made in Lubbock, TX, and grow out and selection of subsequent generations were completed in breeding nurseries throughout Texas over a period of years. Once selected, these lines were tested for agronomic performance and grain weathering in replicated trials over a period of 4 yr. Tx3364 through Tx3407 germplasm lines are resistant to grain weathering caused by diverse fungal genera that include Fusarium spp., Curvularia spp., and Alternaria spp. They are of diverse pedigree and parentage and represent an array of combinations for grain color, plant color, and other agronomic traits. These lines provide the sorghum industry with sources of grain weathering resistance in elite genetic backgrounds.