Novel Simulation of Grinding with Diamond Wheel by using Lattice Point Interference Method (LIM)

A novel method of grinding simulation, designated by Lattice point Interference Method(LIM), is proposed. In the LIM, it is assumed that a work and a wheel expressed by sets of three-dimensional lattice points, material removals are carried out by interference of abrasive lattice points and work ones. The LIM is applied to grinding with two types of grinding wheel; the one has uniformly distributed abrasive grains, the other randomly distributed ones. The effects of abrasive grain distribution and grain supporting stiffness on grain depth of cut are investigated. It is revealed that the wheel with uniformly distributed grains has an advantage in getting narrower dispersion of grain depth of cut in case of high effective compliances of grain supporting bond cPm(c; compliance of grain supporting bond, Pro; hardness of work).