Characteristics of Films Deposited by New LPCVD Using Lamp Heating: Measurement Method of Young's Modulus by Large Bending Theory and Mechanical Characteristics of Polysilicon Film Deposited

The production of prototype of new LPCVD using lamp heating and its study of the characteristics of polysilicon film deposition were reported. When a micro machine is produced using polysilicon film deposited with this equipment, we will need to know the mechanical characteristic of this film. The conventional measurement methods of mechanical characteristics of films are not suited for thick film deposited using this equipment. So, first a suitable bending test, mothod in thick film were proposed and then Young's modulus of the polysilicon film deposited by the new LPCVD by the method were measured. The results of this study are summarized as follows; (1)The large bending test method is useful for measuring the Young's modulus of the polysilicon deposited by the new LPCVD. (2)Reliability of this measurement method is about 90%. (3)The average values of Young's modulus mesured is 121.4±7.1GPa.