Analysis of Polishing Mechanism by Visco-elasticity Dynamic Behavior of Polishing Pads

The purpose of this study is to analyze the thickness deviation conditioning effect of the polishing by a polishing pad. The quartz crystal unit that oscillates directly with more than 100MHz requires the polishing, of thickness less than 17μm and the thickness deviation 0.3μm (a wafer) within. The working became possible with the composite plate that attached quartz wafer (a diameter 76mm) and a standard plate. However, it is difficult to do wide area a highly precise polishing. The action of a polishing pad is important to grasp the dynamic behavior of polishing pad that is able to reproduce the condition of polishing. It became possible with 4 elements of Burgers model of a visco-elasticity. The thickness deviation conditioning effect that calculated it from the dynamic character and vibration analysis confirmed the appropriateness from the comparison with an experiment value.