Grinding Performances of Directionally Aligned SiC Whisker Wheel: Constituents of Grinding Wheel and Finished Surface Roughness
This paper examines the grinding performances of SiC whisker wheel. The effect of various parameters of wheel on the surface finish are clarified. The selected parameters related to the grinding wheel design are the segment width, additive, whisker diameter and bonding material. The experimental res...
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| Veröffentlicht in: | Journal of the Japan Society for Precision Engineering 1996/11/05, Vol.62(11), pp.1627-1631 |
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| container_end_page | 1631 |
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| container_issue | 11 |
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| container_title | Journal of the Japan Society for Precision Engineering |
| container_volume | 62 |
| creator | YAMAGUCHI, Katsumi HORAGUCHI, Iwao |
| description | This paper examines the grinding performances of SiC whisker wheel. The effect of various parameters of wheel on the surface finish are clarified. The selected parameters related to the grinding wheel design are the segment width, additive, whisker diameter and bonding material. The experimental results obtained are as follows : (1) The smaller the diameter of whisker and thenarrower the segment width, the better the surface finish. The resin bonded wheel with Cr2O3 additive has shown the best surface finish. (2) The ultra fine grinding chips and the finished surface have been observed. (3) Surface finish with a roughness value of 1.5 nmRa has been successfully obtained. |
| doi_str_mv | 10.2493/jjspe.62.1627 |
| format | Article |
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The effect of various parameters of wheel on the surface finish are clarified. The selected parameters related to the grinding wheel design are the segment width, additive, whisker diameter and bonding material. The experimental results obtained are as follows : (1) The smaller the diameter of whisker and thenarrower the segment width, the better the surface finish. The resin bonded wheel with Cr2O3 additive has shown the best surface finish. (2) The ultra fine grinding chips and the finished surface have been observed. (3) Surface finish with a roughness value of 1.5 nmRa has been successfully obtained.</description><identifier>ISSN: 0912-0289</identifier><identifier>EISSN: 1882-675X</identifier><identifier>DOI: 10.2493/jjspe.62.1627</identifier><language>jpn</language><publisher>The Japan Society for Precision Engineering</publisher><subject>additive ; bond ; directional alignment ; grinding wheel ; resinoid wheel ; segment width ; SiC whisker ; surface roughness</subject><ispartof>Journal of the Japan Society for Precision Engineering, 1996/11/05, Vol.62(11), pp.1627-1631</ispartof><rights>by The Japan Society for Precision Engineering</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,4010,27900,27901,27902</link.rule.ids></links><search><creatorcontrib>YAMAGUCHI, Katsumi</creatorcontrib><creatorcontrib>HORAGUCHI, Iwao</creatorcontrib><title>Grinding Performances of Directionally Aligned SiC Whisker Wheel: Constituents of Grinding Wheel and Finished Surface Roughness</title><title>Journal of the Japan Society for Precision Engineering</title><addtitle>Journal of the Japan Society for Precision Engineering</addtitle><description>This paper examines the grinding performances of SiC whisker wheel. The effect of various parameters of wheel on the surface finish are clarified. The selected parameters related to the grinding wheel design are the segment width, additive, whisker diameter and bonding material. The experimental results obtained are as follows : (1) The smaller the diameter of whisker and thenarrower the segment width, the better the surface finish. The resin bonded wheel with Cr2O3 additive has shown the best surface finish. (2) The ultra fine grinding chips and the finished surface have been observed. (3) Surface finish with a roughness value of 1.5 nmRa has been successfully obtained.</description><subject>additive</subject><subject>bond</subject><subject>directional alignment</subject><subject>grinding wheel</subject><subject>resinoid wheel</subject><subject>segment width</subject><subject>SiC whisker</subject><subject>surface roughness</subject><issn>0912-0289</issn><issn>1882-675X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1996</creationdate><recordtype>article</recordtype><recordid>eNo9kDtPwzAUhS0EElHpyJ4_kOJH48dGFaCtVAkkQLBZjn2duqRJZXfpvyd9qMs9w_3OGT6EHgme0KliT5tN2sGE0wnhVNygjEhJCy7K31uUYUVogalU92icUqgxplxgymiGnucxdC50Tf4B0fdxazoLKe99_hIi2H3oO9O2h3zWhqYDl3-GKv9Zh_QHcUiA9gHdedMmGF9yhL7fXr-qRbF6ny-r2aqwlGBRSKWItEoBB28UrgVzjnjuGS7rEjxjRDiDoWR1yR34UllWOzylxgg-lcN_hIrzro19ShG83sWwNfGgCdZHA_pkQHOqjwYGfnHmN2lvGrjSJu6DbeFMEyX5qUEu91i9InZtooaO_QMjEGj-</recordid><startdate>1996</startdate><enddate>1996</enddate><creator>YAMAGUCHI, Katsumi</creator><creator>HORAGUCHI, Iwao</creator><general>The Japan Society for Precision Engineering</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>1996</creationdate><title>Grinding Performances of Directionally Aligned SiC Whisker Wheel</title><author>YAMAGUCHI, Katsumi ; HORAGUCHI, Iwao</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2107-89918c99e6efa90b73dd1f6f305b5ef3317da0e53b56def59c3bd042aa7648f33</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>jpn</language><creationdate>1996</creationdate><topic>additive</topic><topic>bond</topic><topic>directional alignment</topic><topic>grinding wheel</topic><topic>resinoid wheel</topic><topic>segment width</topic><topic>SiC whisker</topic><topic>surface roughness</topic><toplevel>online_resources</toplevel><creatorcontrib>YAMAGUCHI, Katsumi</creatorcontrib><creatorcontrib>HORAGUCHI, Iwao</creatorcontrib><collection>CrossRef</collection><jtitle>Journal of the Japan Society for Precision Engineering</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>YAMAGUCHI, Katsumi</au><au>HORAGUCHI, Iwao</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Grinding Performances of Directionally Aligned SiC Whisker Wheel: Constituents of Grinding Wheel and Finished Surface Roughness</atitle><jtitle>Journal of the Japan Society for Precision Engineering</jtitle><addtitle>Journal of the Japan Society for Precision Engineering</addtitle><date>1996</date><risdate>1996</risdate><volume>62</volume><issue>11</issue><spage>1627</spage><epage>1631</epage><pages>1627-1631</pages><issn>0912-0289</issn><eissn>1882-675X</eissn><abstract>This paper examines the grinding performances of SiC whisker wheel. The effect of various parameters of wheel on the surface finish are clarified. The selected parameters related to the grinding wheel design are the segment width, additive, whisker diameter and bonding material. The experimental results obtained are as follows : (1) The smaller the diameter of whisker and thenarrower the segment width, the better the surface finish. The resin bonded wheel with Cr2O3 additive has shown the best surface finish. (2) The ultra fine grinding chips and the finished surface have been observed. (3) Surface finish with a roughness value of 1.5 nmRa has been successfully obtained.</abstract><pub>The Japan Society for Precision Engineering</pub><doi>10.2493/jjspe.62.1627</doi><tpages>5</tpages><oa>free_for_read</oa></addata></record> |
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| identifier | ISSN: 0912-0289 |
| ispartof | Journal of the Japan Society for Precision Engineering, 1996/11/05, Vol.62(11), pp.1627-1631 |
| issn | 0912-0289 1882-675X |
| language | jpn |
| recordid | cdi_crossref_primary_10_2493_jjspe_62_1627 |
| source | EZB-FREE-00999 freely available EZB journals |
| subjects | additive bond directional alignment grinding wheel resinoid wheel segment width SiC whisker surface roughness |
| title | Grinding Performances of Directionally Aligned SiC Whisker Wheel: Constituents of Grinding Wheel and Finished Surface Roughness |
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