Grinding Performances of Directionally Aligned SiC Whisker Wheel: Constituents of Grinding Wheel and Finished Surface Roughness

This paper examines the grinding performances of SiC whisker wheel. The effect of various parameters of wheel on the surface finish are clarified. The selected parameters related to the grinding wheel design are the segment width, additive, whisker diameter and bonding material. The experimental res...

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Veröffentlicht in:Journal of the Japan Society for Precision Engineering 1996/11/05, Vol.62(11), pp.1627-1631
Hauptverfasser: YAMAGUCHI, Katsumi, HORAGUCHI, Iwao
Format: Artikel
Sprache:jpn
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Zusammenfassung:This paper examines the grinding performances of SiC whisker wheel. The effect of various parameters of wheel on the surface finish are clarified. The selected parameters related to the grinding wheel design are the segment width, additive, whisker diameter and bonding material. The experimental results obtained are as follows : (1) The smaller the diameter of whisker and thenarrower the segment width, the better the surface finish. The resin bonded wheel with Cr2O3 additive has shown the best surface finish. (2) The ultra fine grinding chips and the finished surface have been observed. (3) Surface finish with a roughness value of 1.5 nmRa has been successfully obtained.
ISSN:0912-0289
1882-675X
DOI:10.2493/jjspe.62.1627