Chip Breaking Process Simulation by Thermo-Elastic Plastic Finite Elemeut Method

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Veröffentlicht in:	Seimitsu Kōgakkaishi 1996, Vol.62 (8), p.1161-1166
Hauptverfasser:	SHINOZUKA, Jun, OBIKAWA, Toshiyuki, SHIRAKASHI, Takahiro
Format:	Artikel
Sprache:	jpn
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container_end_page	1166
container_issue	8
container_start_page	1161
container_title	Seimitsu Kōgakkaishi
container_volume	62
creator	SHINOZUKA, Jun OBIKAWA, Toshiyuki SHIRAKASHI, Takahiro
description
doi_str_mv	10.2493/jjspe.62.1161
format	Article
fullrecord	<record><control><sourceid>crossref</sourceid><recordid>TN_cdi_crossref_primary_10_2493_jjspe_62_1161</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>10_2493_jjspe_62_1161</sourcerecordid><originalsourceid>FETCH-LOGICAL-c1781-aeb4b6529c04c3bb39abaddbe9d23869a1491ebc18f94a8eec957e25ce18bbcd3</originalsourceid><addsrcrecordid>eNot0EFLwzAYgOEgCpa5o_f8gdR8SZsmRx2bChMHTvBWkvSrzWzXkXSH_XuZ7vTe3sNDyD3wXBRGPux26YC5EjmAgiuSgdaCqar8uiYZNyAYF9rcknlKwXEuVMWFFBnZLLpwoE8R7U_Yf9NNHD2mRD_CcOztFMY9dSe67TAOI1v2Nk3B082lq7APE9JljwMeJ_qGUzc2d-SmtX3C-aUz8rlabhcvbP3-_Lp4XDMPlQZm0RVOlcJ4XnjpnDTW2aZxaBohtTIWCgPoPOjWFFYjelNWKEqPoJ3zjZwR9v_1cUwpYlsfYhhsPNXA67NI_SdSK1GfReQvQ1RWkw</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Chip Breaking Process Simulation by Thermo-Elastic Plastic Finite Elemeut Method</title><source>Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals</source><creator>SHINOZUKA, Jun ; OBIKAWA, Toshiyuki ; SHIRAKASHI, Takahiro</creator><creatorcontrib>SHINOZUKA, Jun ; OBIKAWA, Toshiyuki ; SHIRAKASHI, Takahiro</creatorcontrib><identifier>ISSN: 0912-0289</identifier><identifier>EISSN: 1882-675X</identifier><identifier>DOI: 10.2493/jjspe.62.1161</identifier><language>jpn</language><ispartof>Seimitsu Kōgakkaishi, 1996, Vol.62 (8), p.1161-1166</ispartof><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c1781-aeb4b6529c04c3bb39abaddbe9d23869a1491ebc18f94a8eec957e25ce18bbcd3</citedby></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,776,780,4010,27900,27901,27902</link.rule.ids></links><search><creatorcontrib>SHINOZUKA, Jun</creatorcontrib><creatorcontrib>OBIKAWA, Toshiyuki</creatorcontrib><creatorcontrib>SHIRAKASHI, Takahiro</creatorcontrib><title>Chip Breaking Process Simulation by Thermo-Elastic Plastic Finite Elemeut Method</title><title>Seimitsu Kōgakkaishi</title><issn>0912-0289</issn><issn>1882-675X</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1996</creationdate><recordtype>article</recordtype><recordid>eNot0EFLwzAYgOEgCpa5o_f8gdR8SZsmRx2bChMHTvBWkvSrzWzXkXSH_XuZ7vTe3sNDyD3wXBRGPux26YC5EjmAgiuSgdaCqar8uiYZNyAYF9rcknlKwXEuVMWFFBnZLLpwoE8R7U_Yf9NNHD2mRD_CcOztFMY9dSe67TAOI1v2Nk3B082lq7APE9JljwMeJ_qGUzc2d-SmtX3C-aUz8rlabhcvbP3-_Lp4XDMPlQZm0RVOlcJ4XnjpnDTW2aZxaBohtTIWCgPoPOjWFFYjelNWKEqPoJ3zjZwR9v_1cUwpYlsfYhhsPNXA67NI_SdSK1GfReQvQ1RWkw</recordid><startdate>1996</startdate><enddate>1996</enddate><creator>SHINOZUKA, Jun</creator><creator>OBIKAWA, Toshiyuki</creator><creator>SHIRAKASHI, Takahiro</creator><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>1996</creationdate><title>Chip Breaking Process Simulation by Thermo-Elastic Plastic Finite Elemeut Method</title><author>SHINOZUKA, Jun ; OBIKAWA, Toshiyuki ; SHIRAKASHI, Takahiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c1781-aeb4b6529c04c3bb39abaddbe9d23869a1491ebc18f94a8eec957e25ce18bbcd3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>jpn</language><creationdate>1996</creationdate><toplevel>online_resources</toplevel><creatorcontrib>SHINOZUKA, Jun</creatorcontrib><creatorcontrib>OBIKAWA, Toshiyuki</creatorcontrib><creatorcontrib>SHIRAKASHI, Takahiro</creatorcontrib><collection>CrossRef</collection><jtitle>Seimitsu Kōgakkaishi</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>SHINOZUKA, Jun</au><au>OBIKAWA, Toshiyuki</au><au>SHIRAKASHI, Takahiro</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Chip Breaking Process Simulation by Thermo-Elastic Plastic Finite Elemeut Method</atitle><jtitle>Seimitsu Kōgakkaishi</jtitle><date>1996</date><risdate>1996</risdate><volume>62</volume><issue>8</issue><spage>1161</spage><epage>1166</epage><pages>1161-1166</pages><issn>0912-0289</issn><eissn>1882-675X</eissn><doi>10.2493/jjspe.62.1161</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record>
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ispartof	Seimitsu Kōgakkaishi, 1996, Vol.62 (8), p.1161-1166
issn	0912-0289 1882-675X
language	jpn
recordid	cdi_crossref_primary_10_2493_jjspe_62_1161
source	Elektronische Zeitschriftenbibliothek - Frei zugängliche E-Journals
title	Chip Breaking Process Simulation by Thermo-Elastic Plastic Finite Elemeut Method
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-30T07%3A18%3A29IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Chip%20Breaking%20Process%20Simulation%20by%20Thermo-Elastic%20Plastic%20Finite%20Elemeut%20Method&rft.jtitle=Seimitsu%20Ko%CC%84gakkaishi&rft.au=SHINOZUKA,%20Jun&rft.date=1996&rft.volume=62&rft.issue=8&rft.spage=1161&rft.epage=1166&rft.pages=1161-1166&rft.issn=0912-0289&rft.eissn=1882-675X&rft_id=info:doi/10.2493/jjspe.62.1161&rft_dat=%3Ccrossref%3E10_2493_jjspe_62_1161%3C/crossref%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true