A Basic Study for System of Prediction Instrument Controlling Process (2nd Report): Polishing Process of Silicon Wafer (100) Surface

In this study, the following conclusion has been obtained by introducing the SN technique into evaluation of the polishing of silicon wafer and examining the reason-ability to use characteristics value for determining an optimum machining condition. It is found that evaluation of an optimum machining condition according to the minimizing characteristic and aiming characteristic is controlled by the confidence limit and error to the confirmation test is considerably small where the evaluation is applicable as an evaluation characteristic value. The experiment described in this paper confirms that mathematical tool for an evaluation of the optimum machining condition can be applied in the skillful polishing process domain. And also, analytical and experimental considerations on the polishing accuracies and performance were accorded with explanation from the polishing mechanism.