A low loss microstrip line on thin flexible substrate film by defected ground structure

In this paper, a low loss micro-strip line (MSL) on thin flexible substrate was realized using defected ground structure (DGS). DGS allows thinner MSL than conventional MSL maintaining insertion loss and far-end crosstalk. MSL with DGS on the flexible substrate with a thickness 25 µm was realized the same insertion loss and far-end crosstalk in comparison with conventional MSL on the substrate with a thickness 50 µm while analyzing by 3D electromagnetic simulation. The MSL with DGS was fabricated and evaluated to confirm the simulated results. Excellent agreement with the measurement results was demonstrated over the broad bandwidth of 1-40 GHz.