Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment

— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflecti...

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Veröffentlicht in:Journal of the Society for Information Display 2007-07, Vol.15 (7), p.445-454
Hauptverfasser: Raupp, Gregory B., O'Rourke, Shawn M., Moyer, Curt, O'Brien, Barry P., Ageno, Scott K., Loy, Douglas E., Bawolek, Edward J., Allee, David R., Venugopal, Sameer M., Kaminski, Jann, Bottesch, Dirk, Dailey, Jeff, Long, Ke, Marrs, Michael, Munizza, Nick R., Haverinen, Hanna, Colaneri, Nicholas
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container_end_page 454
container_issue 7
container_start_page 445
container_title Journal of the Society for Information Display
container_volume 15
creator Raupp, Gregory B.
O'Rourke, Shawn M.
Moyer, Curt
O'Brien, Barry P.
Ageno, Scott K.
Loy, Douglas E.
Bawolek, Edward J.
Allee, David R.
Venugopal, Sameer M.
Kaminski, Jann
Bottesch, Dirk
Dailey, Jeff
Long, Ke
Marrs, Michael
Munizza, Nick R.
Haverinen, Hanna
Colaneri, Nicholas
description — A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low‐temperature (180°C) a‐Si:H process on the 6‐in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless‐steel substrates, to form factor scale‐up of the TFT arrays, and finally manufacturing scale‐up to a Gen 2 (370 × 470 mm) display‐scale pilot line, will be reviewed.
doi_str_mv 10.1889/1.2759549
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subjects amorphous silicon
backplane electronics
Flexible displays
pilot-line manufacturing
thin-film transistors
title Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment
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