Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment
— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflecti...
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Veröffentlicht in: | Journal of the Society for Information Display 2007-07, Vol.15 (7), p.445-454 |
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creator | Raupp, Gregory B. O'Rourke, Shawn M. Moyer, Curt O'Brien, Barry P. Ageno, Scott K. Loy, Douglas E. Bawolek, Edward J. Allee, David R. Venugopal, Sameer M. Kaminski, Jann Bottesch, Dirk Dailey, Jeff Long, Ke Marrs, Michael Munizza, Nick R. Haverinen, Hanna Colaneri, Nicholas |
description | — A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low‐temperature (180°C) a‐Si:H process on the 6‐in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless‐steel substrates, to form factor scale‐up of the TFT arrays, and finally manufacturing scale‐up to a Gen 2 (370 × 470 mm) display‐scale pilot line, will be reviewed. |
doi_str_mv | 10.1889/1.2759549 |
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fullrecord | <record><control><sourceid>wiley_cross</sourceid><recordid>TN_cdi_crossref_primary_10_1889_1_2759549</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JSID1515</sourcerecordid><originalsourceid>FETCH-LOGICAL-c3075-38a708038bffcbe271dcfcebf273dbe2d1f81ca4f65b047dd0905c127f6322a43</originalsourceid><addsrcrecordid>eNp1kD1P3TAUhqOqlUppB_6BVwaDP-LYGfm8gCI6FMpoOc4xGBw7snOBu_LLCbqoW6fzHul53uGtqj1KDqhS7SE9YFK0om6_VDu05QrzRsivSyaSYtIy9r36UcojIawRdbNTvXXpBc8wTpDNvM6AzJjy9JDWBRcfvE0R9cY-TcFEQDPYh5hCut-gAZ4hpGmEOCOXMnIBXn0fAA2-LPCmIB-RQaOJa2fs0uzjPZp8SDMOfqmC-Oxzih_-z-qbM6HAr8-7W92en92cXODu9-ry5KjDlhMpMFdGEkW46p2zPTBJB-ss9I5JPiz_QJ2i1tSuET2p5TCQlghLmXQNZ8zUfLfa3_banErJ4PSU_WjyRlOiP8bTVH-Ot7CHW_bFB9j8H9RXfy5PqaBiMfDW8GWG13-GyU-6kVwKfXe90ivFur_H3YVW_B0StYN7</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment</title><source>Wiley Online Library Journals Frontfile Complete</source><creator>Raupp, Gregory B. ; O'Rourke, Shawn M. ; Moyer, Curt ; O'Brien, Barry P. ; Ageno, Scott K. ; Loy, Douglas E. ; Bawolek, Edward J. ; Allee, David R. ; Venugopal, Sameer M. ; Kaminski, Jann ; Bottesch, Dirk ; Dailey, Jeff ; Long, Ke ; Marrs, Michael ; Munizza, Nick R. ; Haverinen, Hanna ; Colaneri, Nicholas</creator><creatorcontrib>Raupp, Gregory B. ; O'Rourke, Shawn M. ; Moyer, Curt ; O'Brien, Barry P. ; Ageno, Scott K. ; Loy, Douglas E. ; Bawolek, Edward J. ; Allee, David R. ; Venugopal, Sameer M. ; Kaminski, Jann ; Bottesch, Dirk ; Dailey, Jeff ; Long, Ke ; Marrs, Michael ; Munizza, Nick R. ; Haverinen, Hanna ; Colaneri, Nicholas</creatorcontrib><description>— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low‐temperature (180°C) a‐Si:H process on the 6‐in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless‐steel substrates, to form factor scale‐up of the TFT arrays, and finally manufacturing scale‐up to a Gen 2 (370 × 470 mm) display‐scale pilot line, will be reviewed.</description><identifier>ISSN: 1071-0922</identifier><identifier>EISSN: 1938-3657</identifier><identifier>DOI: 10.1889/1.2759549</identifier><language>eng</language><publisher>Oxford, UK: Blackwell Publishing Ltd</publisher><subject>amorphous silicon ; backplane electronics ; Flexible displays ; pilot-line manufacturing ; thin-film transistors</subject><ispartof>Journal of the Society for Information Display, 2007-07, Vol.15 (7), p.445-454</ispartof><rights>2007 Society for Information Display</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c3075-38a708038bffcbe271dcfcebf273dbe2d1f81ca4f65b047dd0905c127f6322a43</citedby><cites>FETCH-LOGICAL-c3075-38a708038bffcbe271dcfcebf273dbe2d1f81ca4f65b047dd0905c127f6322a43</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktopdf>$$Uhttps://onlinelibrary.wiley.com/doi/pdf/10.1889%2F1.2759549$$EPDF$$P50$$Gwiley$$H</linktopdf><linktohtml>$$Uhttps://onlinelibrary.wiley.com/doi/full/10.1889%2F1.2759549$$EHTML$$P50$$Gwiley$$H</linktohtml><link.rule.ids>314,776,780,1411,27901,27902,45550,45551</link.rule.ids></links><search><creatorcontrib>Raupp, Gregory B.</creatorcontrib><creatorcontrib>O'Rourke, Shawn M.</creatorcontrib><creatorcontrib>Moyer, Curt</creatorcontrib><creatorcontrib>O'Brien, Barry P.</creatorcontrib><creatorcontrib>Ageno, Scott K.</creatorcontrib><creatorcontrib>Loy, Douglas E.</creatorcontrib><creatorcontrib>Bawolek, Edward J.</creatorcontrib><creatorcontrib>Allee, David R.</creatorcontrib><creatorcontrib>Venugopal, Sameer M.</creatorcontrib><creatorcontrib>Kaminski, Jann</creatorcontrib><creatorcontrib>Bottesch, Dirk</creatorcontrib><creatorcontrib>Dailey, Jeff</creatorcontrib><creatorcontrib>Long, Ke</creatorcontrib><creatorcontrib>Marrs, Michael</creatorcontrib><creatorcontrib>Munizza, Nick R.</creatorcontrib><creatorcontrib>Haverinen, Hanna</creatorcontrib><creatorcontrib>Colaneri, Nicholas</creatorcontrib><title>Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment</title><title>Journal of the Society for Information Display</title><description>— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low‐temperature (180°C) a‐Si:H process on the 6‐in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless‐steel substrates, to form factor scale‐up of the TFT arrays, and finally manufacturing scale‐up to a Gen 2 (370 × 470 mm) display‐scale pilot line, will be reviewed.</description><subject>amorphous silicon</subject><subject>backplane electronics</subject><subject>Flexible displays</subject><subject>pilot-line manufacturing</subject><subject>thin-film transistors</subject><issn>1071-0922</issn><issn>1938-3657</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2007</creationdate><recordtype>article</recordtype><recordid>eNp1kD1P3TAUhqOqlUppB_6BVwaDP-LYGfm8gCI6FMpoOc4xGBw7snOBu_LLCbqoW6fzHul53uGtqj1KDqhS7SE9YFK0om6_VDu05QrzRsivSyaSYtIy9r36UcojIawRdbNTvXXpBc8wTpDNvM6AzJjy9JDWBRcfvE0R9cY-TcFEQDPYh5hCut-gAZ4hpGmEOCOXMnIBXn0fAA2-LPCmIB-RQaOJa2fs0uzjPZp8SDMOfqmC-Oxzih_-z-qbM6HAr8-7W92en92cXODu9-ry5KjDlhMpMFdGEkW46p2zPTBJB-ss9I5JPiz_QJ2i1tSuET2p5TCQlghLmXQNZ8zUfLfa3_banErJ4PSU_WjyRlOiP8bTVH-Ot7CHW_bFB9j8H9RXfy5PqaBiMfDW8GWG13-GyU-6kVwKfXe90ivFur_H3YVW_B0StYN7</recordid><startdate>200707</startdate><enddate>200707</enddate><creator>Raupp, Gregory B.</creator><creator>O'Rourke, Shawn M.</creator><creator>Moyer, Curt</creator><creator>O'Brien, Barry P.</creator><creator>Ageno, Scott K.</creator><creator>Loy, Douglas E.</creator><creator>Bawolek, Edward J.</creator><creator>Allee, David R.</creator><creator>Venugopal, Sameer M.</creator><creator>Kaminski, Jann</creator><creator>Bottesch, Dirk</creator><creator>Dailey, Jeff</creator><creator>Long, Ke</creator><creator>Marrs, Michael</creator><creator>Munizza, Nick R.</creator><creator>Haverinen, Hanna</creator><creator>Colaneri, Nicholas</creator><general>Blackwell Publishing Ltd</general><scope>BSCLL</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>200707</creationdate><title>Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment</title><author>Raupp, Gregory B. ; O'Rourke, Shawn M. ; Moyer, Curt ; O'Brien, Barry P. ; Ageno, Scott K. ; Loy, Douglas E. ; Bawolek, Edward J. ; Allee, David R. ; Venugopal, Sameer M. ; Kaminski, Jann ; Bottesch, Dirk ; Dailey, Jeff ; Long, Ke ; Marrs, Michael ; Munizza, Nick R. ; Haverinen, Hanna ; Colaneri, Nicholas</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c3075-38a708038bffcbe271dcfcebf273dbe2d1f81ca4f65b047dd0905c127f6322a43</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2007</creationdate><topic>amorphous silicon</topic><topic>backplane electronics</topic><topic>Flexible displays</topic><topic>pilot-line manufacturing</topic><topic>thin-film transistors</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Raupp, Gregory B.</creatorcontrib><creatorcontrib>O'Rourke, Shawn M.</creatorcontrib><creatorcontrib>Moyer, Curt</creatorcontrib><creatorcontrib>O'Brien, Barry P.</creatorcontrib><creatorcontrib>Ageno, Scott K.</creatorcontrib><creatorcontrib>Loy, Douglas E.</creatorcontrib><creatorcontrib>Bawolek, Edward J.</creatorcontrib><creatorcontrib>Allee, David R.</creatorcontrib><creatorcontrib>Venugopal, Sameer M.</creatorcontrib><creatorcontrib>Kaminski, Jann</creatorcontrib><creatorcontrib>Bottesch, Dirk</creatorcontrib><creatorcontrib>Dailey, Jeff</creatorcontrib><creatorcontrib>Long, Ke</creatorcontrib><creatorcontrib>Marrs, Michael</creatorcontrib><creatorcontrib>Munizza, Nick R.</creatorcontrib><creatorcontrib>Haverinen, Hanna</creatorcontrib><creatorcontrib>Colaneri, Nicholas</creatorcontrib><collection>Istex</collection><collection>CrossRef</collection><jtitle>Journal of the Society for Information Display</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Raupp, Gregory B.</au><au>O'Rourke, Shawn M.</au><au>Moyer, Curt</au><au>O'Brien, Barry P.</au><au>Ageno, Scott K.</au><au>Loy, Douglas E.</au><au>Bawolek, Edward J.</au><au>Allee, David R.</au><au>Venugopal, Sameer M.</au><au>Kaminski, Jann</au><au>Bottesch, Dirk</au><au>Dailey, Jeff</au><au>Long, Ke</au><au>Marrs, Michael</au><au>Munizza, Nick R.</au><au>Haverinen, Hanna</au><au>Colaneri, Nicholas</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment</atitle><jtitle>Journal of the Society for Information Display</jtitle><date>2007-07</date><risdate>2007</risdate><volume>15</volume><issue>7</issue><spage>445</spage><epage>454</epage><pages>445-454</pages><issn>1071-0922</issn><eissn>1938-3657</eissn><abstract>— A low‐temperature amorphous‐silicon (a‐Si:H) thin‐film‐transistor (TFT) backplane technology for high‐information‐content flexible displays has been developed. Backplanes were integrated with frontplane technologies to produce high‐performance active‐matrix reflective electrophoretic ink, reflective cholesteric liquid crystal and emissive OLED flexible‐display technology demonstrators (TDs). Backplanes up to 4 in. on the diagonal have been fabricated on a 6‐in. wafer‐scale pilot line. The critical steps in the evolution of backplane technology, from qualification of baseline low‐temperature (180°C) a‐Si:H process on the 6‐in. line with rigid substrates, to transferring the process to flexible plastic and flexible stainless‐steel substrates, to form factor scale‐up of the TFT arrays, and finally manufacturing scale‐up to a Gen 2 (370 × 470 mm) display‐scale pilot line, will be reviewed.</abstract><cop>Oxford, UK</cop><pub>Blackwell Publishing Ltd</pub><doi>10.1889/1.2759549</doi><tpages>10</tpages></addata></record> |
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subjects | amorphous silicon backplane electronics Flexible displays pilot-line manufacturing thin-film transistors |
title | Low-temperature amorphous-silicon backplane technology development for flexible displays in a manufacturing pilot-line environment |
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