31.2: Fabrication of 165 μm Pitched PDP Back Panel Based on LTCC-M Technology

31.2: Fabrication of 165 μm Pitched PDP Back Panel Based on LTCC-M Technology

Orion Electric Co. has developed an XGA resolution, 165 μm pitch 25″ Plasma Display Back Panel by combining the process and cost benefits of the LTCC‐M (Low Temperature Co‐fired Ceramic on Metal) substrate technology with a high‐resolution one‐step “Barrier Embossing” technique. Tensile tests on gre...

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Veröffentlicht in:SID International Symposium Digest of technical papers 2000-05, Vol.31 (1), p.478-481
Hauptverfasser: Park, Y. H., Cho, C. R., Kim, I. T., Lee, M. W., Hwang, K. T., Yu, J. D., Mun, J. D., Kong, S. S., Kim, B. K., Sreeram, A. N., Palit, K., Liberatore, M., Tormey, E., Hozer, L., Prabhu, A.
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Sprache:eng
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Zusammenfassung:Orion Electric Co. has developed an XGA resolution, 165 μm pitch 25″ Plasma Display Back Panel by combining the process and cost benefits of the LTCC‐M (Low Temperature Co‐fired Ceramic on Metal) substrate technology with a high‐resolution one‐step “Barrier Embossing” technique. Tensile tests on green sheets were conducted and the effects of green sheet mechanical properties on embossed barrier height were investigated. LTCCM back panels (8″) were sealed to sodalime glass front panels and the assembled parts were successfully evacuated to 10−7 torr without cracks on the glass side.
ISSN:0097-966X
2168-0159
DOI:10.1889/1.1832985