Thick film of modified aluminum with conductivity similar to silver

We have been successfully developed a thick film aluminum-based conductivity (7.329 × 10 –8 Ω m) comparable to thick film silver. Core–shell powders were created by coating aluminum powder with silver using a chemical galvanic replacement reaction, which creates a silver shell around the aluminum particles when aluminum powder is mixed with silver salt. This core–shell particles interacts and turns into an alloy. The Al 2 Ag alloy creates bridging between the particles, resembling a network, which contribute significantly to the thick film's high conductivity. To sustain the particles, nevertheless, by filling the pores and preventing oxidation, glass frit was added. In this work, the impact of the glass frit content is also investigated. The lowest resistivity was reached by adding 3% glass frit and sintering at temperature 600°C. Graphical abstract