Study of Marangoni Force on Meniscus of Silicon Substrate: Effect of Marangoni Force for Particle Removal and Adhesion on Substrate

Drying technique on the basis of Marangoni force is applied to semiconductor or glass substrate drying. In this method, organic vapor such as IPA that decreases surface tension is fed into bath during draining rinse water. Although Marangoni force is expected to enhance removing water from surface, detailed mechanism of the drying process has not been clarified. We analyzed Marangoni force in the neighborhood of the meniscus of substrate using C. F. D. and compared the computational result with the particle removal and adhesion evaluation experiment for both hydrophilic and hydrophobic surface Si wafers. As a result, we find out that the direction of Marangoni force at the top of mensiscus in hydrophobic wafers is opposite to that in hydrophilic wafers. This difference is closely related to the experimental result that particles are effectively removed from hydrophilic wafers and more particles are remained on hydrophobic wafers. Additionally C. F. D. result suggests that Marangoni force depends on the curvature and thickness of boundary layer on the meniscus.