Behavior of Debinding and Sintering in Micron and Submicron-Sized Copper Powder Injection Molded Parts

Behavior of Debinding and Sintering in Micron and Submicron-Sized Copper Powder Injection Molded Parts

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Veröffentlicht in:TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 2013, Vol.79 (807), p.1593-1603
Hauptverfasser: NISHIYABU, Kazuaki, TANABE, Daiki, KANOKO, Yasuhiro, TANAKA, Shigeo
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container_issue 807
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container_title TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
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creator NISHIYABU, Kazuaki
TANABE, Daiki
KANOKO, Yasuhiro
TANAKA, Shigeo
description
doi_str_mv 10.1299/kikaia.79.1593
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title Behavior of Debinding and Sintering in Micron and Submicron-Sized Copper Powder Injection Molded Parts
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