Molecular Dynamics Simulation of Thermal Stress during Rapid Solidification

Thermal stress during rapid solidification is analyzed based on the motion of particles by means of a two-dimensional molecular dynamics method. The Lennard-Jones-type potential is assumed as a two-body potential. The liquid is solidified by reducing the volocities of the particles in the cooled region at a constant rate. The numerical results show that the concept of the thermal stress obtained by molecular dynamics simulation agrees with that used in continuum mechanics if the number of particles is sufficient in the region defining the thermal stress. Thermal stress decreases when lattice defects appear.