Boundary Element Analysis of Steady-State Heat Conduction and Thermal Stresses in the LSI Package

Parametric study on the thermal deformation and the thermal stress of a resin molded package LSI has been performed by the boundary element analysis code, specially developed for this study. The length and the position of the Si chip in the LSI package are employed as the parameters in this study. B...

Ausführliche Beschreibung

Bibliographische Detailangaben

Veröffentlicht in:	TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 1989/06/25, Vol.55(514), pp.1437-1444
Hauptverfasser:	SATO, Mitsuru, YUUKI, Ryoji, YOSHIOKA, Sumio
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Boundary Element Method Heat LSI Numerical Analysis Plastic Package Structural analysis Thermal Stress
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!