Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating
In the nickel electroplating method of stress analysis, a basal copper plating is indispensable when nickel is plated directly on a steel specimen. In this paper, when the acid copper plating deposited in a sulfate bath is utilized as the basal plating, effects of the current density and the thickne...
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Veröffentlicht in: | TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A 1985/11/25, Vol.51(471), pp.2663-2668 |
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container_title | TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A |
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creator | SEIKA, Masaichiro NAGASE, Yasuo HOSONO, Kikuo OYAMA, Tadataka |
description | In the nickel electroplating method of stress analysis, a basal copper plating is indispensable when nickel is plated directly on a steel specimen. In this paper, when the acid copper plating deposited in a sulfate bath is utilized as the basal plating, effects of the current density and the thickness of the basal copper plating on the proper stress of the upper nickel plating are examined, and an optimum condition for the basal copper plating is obtained. From the results obtained in this paper, it is concluded that acid copper plating deposited in a sulfate bath can be used satisfactorily as the basal on in the nickel electroplating method. |
doi_str_mv | 10.1299/kikaia.51.2663 |
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In this paper, when the acid copper plating deposited in a sulfate bath is utilized as the basal plating, effects of the current density and the thickness of the basal copper plating on the proper stress of the upper nickel plating are examined, and an optimum condition for the basal copper plating is obtained. From the results obtained in this paper, it is concluded that acid copper plating deposited in a sulfate bath can be used satisfactorily as the basal on in the nickel electroplating method.</description><identifier>ISSN: 0387-5008</identifier><identifier>EISSN: 1884-8338</identifier><identifier>DOI: 10.1299/kikaia.51.2663</identifier><language>eng ; jpn</language><publisher>The Japan Society of Mechanical Engineers</publisher><subject>Acid Copper Plating ; Basal Plating ; Experimental Stress Analysis ; High Temperature ; Nickel Electroplating Method</subject><ispartof>Transactions of the Japan Society of Mechanical Engineers Series A, 1985/11/25, Vol.51(471), pp.2663-2668</ispartof><rights>The Japan Society of Mechanical Engineers</rights><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,780,784,1883,4024,27923,27924,27925</link.rule.ids></links><search><creatorcontrib>SEIKA, Masaichiro</creatorcontrib><creatorcontrib>NAGASE, Yasuo</creatorcontrib><creatorcontrib>HOSONO, Kikuo</creatorcontrib><creatorcontrib>OYAMA, Tadataka</creatorcontrib><title>Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating</title><title>TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A</title><addtitle>JSMET</addtitle><description>In the nickel electroplating method of stress analysis, a basal copper plating is indispensable when nickel is plated directly on a steel specimen. In this paper, when the acid copper plating deposited in a sulfate bath is utilized as the basal plating, effects of the current density and the thickness of the basal copper plating on the proper stress of the upper nickel plating are examined, and an optimum condition for the basal copper plating is obtained. From the results obtained in this paper, it is concluded that acid copper plating deposited in a sulfate bath can be used satisfactorily as the basal on in the nickel electroplating method.</description><subject>Acid Copper Plating</subject><subject>Basal Plating</subject><subject>Experimental Stress Analysis</subject><subject>High Temperature</subject><subject>Nickel Electroplating Method</subject><issn>0387-5008</issn><issn>1884-8338</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1985</creationdate><recordtype>article</recordtype><recordid>eNo9kMtO40AQRVsjkCYCtrOuDxiHftndZpeJGBjxFI-1Ve6UkyaObXU3C35mvhWbAKurqjr3lnQZ-yX4XMiyPN36LXqc52Iui0L9YDNhrc6sUvaAzbiyJss5tz_ZSYy-5lwJI3ghZ-z_DWF8DbSjLkHfwPLNtd7BYwoUI0XwHVz69QaeaDdQwDSi8IDdmuA5-m4Nt95tqYXzllwK_dBimrZnoNMGHmjoQ_oNiw4WwzDGjse--_jSD2MaPL62DSaCPzjSTR8gbaYhYgv3-6RjdthgG-nkU4_Y89_zp-Vldn138W-5uM6c5FplSknjEO2qRqxlvSpzZ_KVko2StrROO2uE0bKwuuCyRMkLXZq61saRc6hRHbH5PteFPsZATTUEv8PwVgleTQVX-4KrXFRTwaPham94iQnX9I1jSN619ImL0pSTRRvxJZP7m3IbDBV16h3GHIs7</recordid><startdate>1985</startdate><enddate>1985</enddate><creator>SEIKA, Masaichiro</creator><creator>NAGASE, Yasuo</creator><creator>HOSONO, Kikuo</creator><creator>OYAMA, Tadataka</creator><general>The Japan Society of Mechanical Engineers</general><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>1985</creationdate><title>Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating</title><author>SEIKA, Masaichiro ; NAGASE, Yasuo ; HOSONO, Kikuo ; OYAMA, Tadataka</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c2043-3327caa8dbaab2bd95c75d32f32898c4c8717426846029a206497bb47cecca4a3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng ; jpn</language><creationdate>1985</creationdate><topic>Acid Copper Plating</topic><topic>Basal Plating</topic><topic>Experimental Stress Analysis</topic><topic>High Temperature</topic><topic>Nickel Electroplating Method</topic><toplevel>online_resources</toplevel><creatorcontrib>SEIKA, Masaichiro</creatorcontrib><creatorcontrib>NAGASE, Yasuo</creatorcontrib><creatorcontrib>HOSONO, Kikuo</creatorcontrib><creatorcontrib>OYAMA, Tadataka</creatorcontrib><collection>CrossRef</collection><jtitle>TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>SEIKA, Masaichiro</au><au>NAGASE, Yasuo</au><au>HOSONO, Kikuo</au><au>OYAMA, Tadataka</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating</atitle><jtitle>TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A</jtitle><addtitle>JSMET</addtitle><date>1985</date><risdate>1985</risdate><volume>51</volume><issue>471</issue><spage>2663</spage><epage>2668</epage><pages>2663-2668</pages><issn>0387-5008</issn><eissn>1884-8338</eissn><abstract>In the nickel electroplating method of stress analysis, a basal copper plating is indispensable when nickel is plated directly on a steel specimen. In this paper, when the acid copper plating deposited in a sulfate bath is utilized as the basal plating, effects of the current density and the thickness of the basal copper plating on the proper stress of the upper nickel plating are examined, and an optimum condition for the basal copper plating is obtained. From the results obtained in this paper, it is concluded that acid copper plating deposited in a sulfate bath can be used satisfactorily as the basal on in the nickel electroplating method.</abstract><pub>The Japan Society of Mechanical Engineers</pub><doi>10.1299/kikaia.51.2663</doi><tpages>6</tpages><oa>free_for_read</oa></addata></record> |
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language | eng ; jpn |
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source | J-STAGE Free; EZB-FREE-00999 freely available EZB journals |
subjects | Acid Copper Plating Basal Plating Experimental Stress Analysis High Temperature Nickel Electroplating Method |
title | Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating |
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