Measurement of Cyclic Stresses in High Temperature Range Using Nickel Electroplating : 4th Report, An Application of Copper Sulfate Bath for the Basal Plating

In the nickel electroplating method of stress analysis, a basal copper plating is indispensable when nickel is plated directly on a steel specimen. In this paper, when the acid copper plating deposited in a sulfate bath is utilized as the basal plating, effects of the current density and the thickness of the basal copper plating on the proper stress of the upper nickel plating are examined, and an optimum condition for the basal copper plating is obtained. From the results obtained in this paper, it is concluded that acid copper plating deposited in a sulfate bath can be used satisfactorily as the basal on in the nickel electroplating method.