Fundamental Studies on the Copper and Nickel Electroplating Methods of Stress Analysis : Effects of the Ground Plating on the Proper Stress

Effects of the ground plating of alkaline copper on the proper stress in the acid plating of copper or nickel are studied for the purpose of further development of a direct plating method and its application to the foil strain gauge. By using the initial deposited surface and final deposited one of the plating foil as the cementing surface, the difference in occurrence of grown grains and flecks in the foil is inspected. The results are as follows : (1) In the copper plating method, the ground plating is unnecessary for both the direct plating and the foil. (2) In the nickel plating method, the ground plating is necessary for the plating on steel specimens, but is unnecessary for the foil. (3) Flecks observed on the final deposited surface are slip bands produced in the grown grains. (4) If the final deposited surface of the nickel foil is utilized for the cementing surface, the proper stress of the foil gauge lowers and it is available for the practical use.