Dielectric cure analysis of epoxy resins before gelation

Dielectric measuring methods have been widely used for monitoring the curing system of the diglycidyl ether of bisphenol-A (DGEBA), a typical commercially available epoxide oligomer. The uncured DGEBA oligomer is regarded as a simple structural model for the reactive DGEBA-curing agent system before...

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Veröffentlicht in:Progress in rubber, plastics and recycling technology plastics and recycling technology, 2002-08, Vol.18 (3), p.127-159
1. Verfasser: KOIKE, Tsuneo
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description Dielectric measuring methods have been widely used for monitoring the curing system of the diglycidyl ether of bisphenol-A (DGEBA), a typical commercially available epoxide oligomer. The uncured DGEBA oligomer is regarded as a simple structural model for the reactive DGEBA-curing agent system before gelation. Dielectric monitoring methods, which are based on viscoelastic data of uncured DGEBA, are reviewed in terms of the real-time monitoring of the DGEBA curing system.
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subjects Applied sciences
Chemical properties
Exact sciences and technology
Polymer industry, paints, wood
Properties and testing
Technology of polymers
title Dielectric cure analysis of epoxy resins before gelation
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