Dielectric cure analysis of epoxy resins before gelation
Dielectric measuring methods have been widely used for monitoring the curing system of the diglycidyl ether of bisphenol-A (DGEBA), a typical commercially available epoxide oligomer. The uncured DGEBA oligomer is regarded as a simple structural model for the reactive DGEBA-curing agent system before...
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Veröffentlicht in: | Progress in rubber, plastics and recycling technology plastics and recycling technology, 2002-08, Vol.18 (3), p.127-159 |
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description | Dielectric measuring methods have been widely used for monitoring the curing system of the diglycidyl ether of bisphenol-A (DGEBA), a typical commercially available epoxide oligomer. The uncured DGEBA oligomer is regarded as a simple structural model for the reactive DGEBA-curing agent system before gelation. Dielectric monitoring methods, which are based on viscoelastic data of uncured DGEBA, are reviewed in terms of the real-time monitoring of the DGEBA curing system. |
doi_str_mv | 10.1177/147776060201800301 |
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subjects | Applied sciences Chemical properties Exact sciences and technology Polymer industry, paints, wood Properties and testing Technology of polymers |
title | Dielectric cure analysis of epoxy resins before gelation |
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