Dielectric cure analysis of epoxy resins before gelation

Dielectric measuring methods have been widely used for monitoring the curing system of the diglycidyl ether of bisphenol-A (DGEBA), a typical commercially available epoxide oligomer. The uncured DGEBA oligomer is regarded as a simple structural model for the reactive DGEBA-curing agent system before gelation. Dielectric monitoring methods, which are based on viscoelastic data of uncured DGEBA, are reviewed in terms of the real-time monitoring of the DGEBA curing system.