Dielectric strength and mechanical properties of epoxy resin filled with self-propagating high-temperature synthesized Al 2 O 3 /SiC nanoparticles

In this study, the rice husk as a source of silica was used to synthesize the Al 2 O 3 /SiC composite via the self-propagation high-temperature synthesis (SHS) process. Then, the particle size of the synthesized product was reduced to the nanoscale using a planetary ball mill. Finally, different amo...

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Veröffentlicht in:Journal of composite materials 2020-07, Vol.54 (17), p.2231-2243
Hauptverfasser: Hoseini, M, Dini, G, Bahadori, M
Format: Artikel
Sprache:eng
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Zusammenfassung:In this study, the rice husk as a source of silica was used to synthesize the Al 2 O 3 /SiC composite via the self-propagation high-temperature synthesis (SHS) process. Then, the particle size of the synthesized product was reduced to the nanoscale using a planetary ball mill. Finally, different amounts (5, 10, and 15 wt.%) of Al 2 O 3 /SiC nanoparticles were incorporated into an epoxy resin in order to improve the mechanical properties and the dielectric strength of fabricated epoxy-based composites. The results indicated that the Al 2 O 3 /SiC composite was successfully synthesized by the SHS process from a mixture of the rice husk ash, Al, and carbon black powders as starting materials. The average size of the synthesized Al 2 O 3 /SiC particles decreased to 80 nm after 12-h ball milling. Also, the mechanical properties of the fabricated epoxy-based composite samples were improved with the addition of Al 2 O 3 /SiC nanoparticles in the investigated range in comparison with the pure epoxy sample. Additionally, the overall dielectric strength of the fabricated epoxy-based composites containing 5–15 wt.% of Al 2 O 3 /SiC nanoparticles was higher than that of the pure epoxy. These results were interpreted in terms of the synthesis mechanism of Al 2 O 3 /SiC composite via the SHS process, the rice husk ash structure, the interfacial bonding between the polymer chains and the surface of nanoparticles, and the insulation nature of the synthesized nanoparticles.
ISSN:0021-9983
1530-793X
DOI:10.1177/0021998319891202