(Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements

(Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements

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Veröffentlicht in:ECS Meeting Abstracts 2021-10, Vol.MA2021-02 (14), p.662-662
Hauptverfasser: Moreau, Stéphane, Jourdon, Joris, Lhostis, Sandrine, Bouchu, David, Ayoub, Bassel, Arnaud, Lucile, Fremont, Helene
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Sprache:eng
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Engineering Sciences
Micro and nanotechnologies
Microelectronics
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Jourdon, Joris
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description
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subjects Engineering Sciences
Micro and nanotechnologies
Microelectronics
title (Invited) Hybrid Bonding-Based Interconnects: A Status on the Last Robustness and Reliability Achievements
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