(Invited) Material and Process Optimization for the Scale-up of Printed OTFT on Printing Pilot Line

This paper introduce the PICTIC Printing Pilot line and related activities for the development of printed electronic. In particular, through Collaborative Project and internal Development, CEA-LITEN and partners have been working on the transfer and scale-up of OTFT Circuits from Lab to Printing Pilot Line (GEN1). The paper will present the Materials, Tools and Characterization Protocols that have been co-developed at CEA-LITEN with partners from the ATLASS European Project. Material strategy and inks developed for robust printing capability and the engraving technologies engineered for the downscaling of printed pattern down to 150 µm and beyond will be presented. We will discuss characterization protocols set-up to tune inks and process recipes and introduce the Automated Inspection Tools developed to support the yield and TRL improvement. Electrical performances of OTFT fabricated on GEN1 pilot line will be also presented (µ > 2cm²/V/s; Vt~ 4.5 V) together with statistics on foils (>100TFTs) and possible track of improvement for résolution and electrical performance scaling will be presented. Figure 1