(Invited) Characterization of an Optically Transparent Thin-Film Electrode Chip for Spectroelectrochemical Sensors
In this work, an optically transparent thin-film electrode chip is investigated for applications in electrochemical and spectroelectrochemical sensing. Compared to other electrode chips that are commercially available, this chip is designed for use with a miniature, portable system to take quick, ac...
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Veröffentlicht in: | Meeting abstracts (Electrochemical Society) 2017-04, Vol.MA2017-01 (41), p.1870-1870 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | In this work, an optically transparent thin-film electrode chip is investigated for applications in electrochemical and spectroelectrochemical sensing. Compared to other electrode chips that are commercially available, this chip is designed for use with a miniature, portable system to take quick, accurate point of care measurements as well as long-term usage, such as environmental monitoring.
The electrode chip is fabricated from standard photolithography and thin-film deposition methods over 1.1 mm thick boro-aluminosilicate glass substrates. The use of glass as a substrate minimizes fluorescence background interferences that would be seen with plastic substrates. The chip has three electrodes: an indium tin oxide (ITO) working electrode (WE, 200 nm), a platinum quasi-reference electrode (RE, 200 nm), and a platinum auxiliary electrode (AE, 200 nm), as shown in Fig. 1a. The optically transparent electrode (OTE) ITO allows for spectroscopic detection using both absorption and fluorescence. The surface of the electrode area is defined by applying a protective photoresist over the chip, leaving the three-electrode area and the electrode leads exposed. The dimensions of the electrode area are 8 mm × 40 mm. The surface area of the working electrode is 7 mm
2
; the reference is 1 µm
2
; and the auxiliary is 39 mm
2
.
To improve the stability of the quasi-reference electrode, the platinum reference surface was coated with a planar Ag/AgCl layer. This was done by electroplating silver over the platinum reference electrode using 0.3 M AgNO
3
in 1 M NH
3
. The electroplated surface was then covered with a solution of 50 mM FeCl
3
to chemically oxidize AgCl on top of the silver. Open circuit measurements against a commercial Ag/AgCl reference indicate that the potential of the planar Ag/AgCl reference on the electrode chip varies a maximum 1 mV within the same time span for measurements of the platinum reference electrode to vary nearly 1 V. Cyclic voltammetry measurements of 0.1 mM [Fe(CN)
6
]
3-
(0.1 M KCl) using the electrode chip with the planar Ag/AgCl reference shows stable voltammograms over 180 cycles. The formal reduction potential (E
o
′) of [Fe(CN)
6
]
3-
using the planar reference is E
o
′ = 102 mV (0.1 M Cl
-
). This is 83 mV less than the potential using the commercial reference (E
o
′ = 185 mV, 3 M Cl
-
), as is expected due the difference in chloride ion concentration that the Ag/AgCl electrode is exposed to.
To demonstrate that the electrode chip |
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ISSN: | 2151-2043 2151-2035 |
DOI: | 10.1149/MA2017-01/41/1870 |