Electroless Deposition of Platinum Using Multivalent Metal Ions As Reducing Agents

Two new type electroless plating processes for deposition of continuous platinum layer are proposed. In the presence of different ligands Pt(IV) ions are reduced to the metallic state by means of multivalent metal ions. In the first case Pt(IV) is reduced by Co(II) forming platinum and Co(III): 4Co(II) + Pt(IV) → Pt + 4Co(III). In the second type solutions Pt(IV) is reduced by Ti(III) forming platinum and Ti(IV): 4Ti(III) + Pt(IV) → Pt + 4Ti(IV). The kinetic data of the mentioned reactions are given and discussed. Acknowledgement This research was funded by a Grant (No. TEC-06/2015) from the Research Council of Lithuania.