Liquid Phase Epitaxy (LPE) Formation of Localized High Quality and Mobility Ge & SiGe by High Dose Ge-Implantation with Laser Melt Annealing for 10nm and 7nm Node CMOS Technology

Localized Ge and SiGe high quality/mobility device surface material region on bulk-Si and SOI wafers are needed for 10nm and 7nm node CMOS technology. Traditionally SiGe and Ge device surface material on bulk-Si or SOI wafers are realized by CVD epitaxial growth or Vapor Phase Epi (VPE) at elevated...

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Veröffentlicht in:Meeting abstracts (Electrochemical Society) 2014-08, Vol.MA2014-02 (35), p.1771-1771
Hauptverfasser: Borland, John O, Sugitani, Michiro, Oesterlin, Peter, Johnson, Walt, Buyuklimanli, Temel, Hengstebeck, Robert, Kennon, Ethan, Jones, Kevin Scott, Joshi, Abhijeet
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Sprache:eng
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Zusammenfassung:Localized Ge and SiGe high quality/mobility device surface material region on bulk-Si and SOI wafers are needed for 10nm and 7nm node CMOS technology. Traditionally SiGe and Ge device surface material on bulk-Si or SOI wafers are realized by CVD epitaxial growth or Vapor Phase Epi (VPE) at elevated temperatures. Selective deposition can be achieved with hard mask. To reduce defects strain relaxed buffer (SRB) or aspect ratio trapping (ART) have been employed with bulk-Si or layer transfer wafer bonding for SiGeOI or GeOI. An alternative to VPE is to use either SPE (solid phase epitaxy) or LPE (liquid phase epitaxy) to form SiGe or Ge epitaxial surface layers. Using high dose Ge implantation >E16/cm 2 with photoresist soft mask as proposed in 2004 by Borland et al [1,2]. Localized amorphous Ge surface regions can be formed after Ge-infusion doping by Gas Cluster Ion Beam (GCIB) technique followed by low temperature SPE to form single crystal thin surface Ge epitaxial layers but residual end-of-range (EOR) damage remained. Today, laser melt annealing of implanted junctions are currently being used in production for high quality back-side illuminated CMOS image sensors used in smart phone cameras by several IC and foundry semiconductor manufacturers to completely eliminate any residual implant damage/defects with 100% dopant activation provided the melt depth exceeds the implant damage depth [3]. Last year at IWJT-2013 Borland et al [4] reported using Ge-plasma ion implantation at 1E16/cm 2 and 1E17/cm 2 doses with laser melt annealing to realize up to 55% SiGe by LPE with >4x higher mobility at 160cm 2 /Vs. One limitation they noted with plasma implantation was poor retained dose due to surface sputtering at low energies which limited the Ge content to 400nm and the Ge layer content from 97% down to 2% respectively. We will also show X-TEM of the Ge-LPE region
ISSN:2151-2043
2151-2035
DOI:10.1149/MA2014-02/35/1771