CMP Slurry and Process Development for TSV Front-Side Polishing

3D integration utilizing TSV (Through-Silicon Via) is a promising technology to achieve high performance 3DIC (three-dimentional integrated circuit), not only because it exponentially increases connection efficiency between dies, but also because it can be practically integrated into current IC manu...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Xu, Jinhai, Lin, Paul-Chang, Li, Pei, Zhu, Tony, Ma, Zhiyong, Chen, Danny, Pang, Keliang, Wang, Xucheng, Wang, Yuchun
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!