Modeling Electromigration Lifetimes of Copper Interconnects

A model for early failure due to electromigration in copper dual-damascene interconnects is proposed. The model is based on analytical expressions obtained from solutions of electromigration stress build-up assuming slit void growth under the interconnect vias. It is demonstrated that the model sati...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	De Orio, Roberto L., Ceric, Hajdin, Selberherr, Siegfried
Format:	Tagungsbericht
Sprache:	eng
Online-Zugang:	Volltext
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