(Invited) Physical Modeling of Charge Transport and Degradation in HfO 2 Stacks for Logic Device and Memory Applications
The understanding of the physical mechanisms responsible of charge transport and degradation in high-κ stacks is fundamental for the optimization of advanced logic (MOSFETs) and memory (RRAM, DRAM) devices. In this paper, we present a comprehensive physical model describing the charge transport and...
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Veröffentlicht in: | ECS transactions 2011-06, Vol.37 (1), p.189-197 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | The understanding of the physical mechanisms responsible of charge transport and degradation in high-κ stacks is fundamental for the optimization of advanced logic (MOSFETs) and memory (RRAM, DRAM) devices. In this paper, we present a comprehensive physical model describing the charge transport and the degradation/breakdown processes in the HfO2 layer. This model allows gaining quantitative insights into the physics governing leakage current and degradation processes in HfO2 stacks, reproducing gate current and TDDB statistics |
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ISSN: | 1938-5862 1938-6737 |
DOI: | 10.1149/1.3600739 |