(Invited) Physical Modeling of Charge Transport and Degradation in HfO 2 Stacks for Logic Device and Memory Applications

The understanding of the physical mechanisms responsible of charge transport and degradation in high-κ stacks is fundamental for the optimization of advanced logic (MOSFETs) and memory (RRAM, DRAM) devices. In this paper, we present a comprehensive physical model describing the charge transport and...

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Veröffentlicht in:ECS transactions 2011-06, Vol.37 (1), p.189-197
Hauptverfasser: Larcher, Luca, Padovani, Andrea, Vandelli, Luca, Bersuker, Gennadi
Format: Artikel
Sprache:eng
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Zusammenfassung:The understanding of the physical mechanisms responsible of charge transport and degradation in high-κ stacks is fundamental for the optimization of advanced logic (MOSFETs) and memory (RRAM, DRAM) devices. In this paper, we present a comprehensive physical model describing the charge transport and the degradation/breakdown processes in the HfO2 layer. This model allows gaining quantitative insights into the physics governing leakage current and degradation processes in HfO2 stacks, reproducing gate current and TDDB statistics
ISSN:1938-5862
1938-6737
DOI:10.1149/1.3600739