Etch and Wet Clean Challenges and Joint Optimization

The emergence of new integration schemes and materials for advanced technology nodes has presented greater challenges to both etch and post etch wet clean. The mutual interactions between etch and clean processes must be considered, thus having both etch and clean process optimized together has beco...

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Bibliographische Detailangaben
Hauptverfasser: Yen, Bi-Ming, Lin, Johnny, Lee, Chris, Hegarty, Mike, Loewenhardt, Peter
Format: Tagungsbericht
Sprache:eng
Online-Zugang:Volltext
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Beschreibung
Zusammenfassung:The emergence of new integration schemes and materials for advanced technology nodes has presented greater challenges to both etch and post etch wet clean. The mutual interactions between etch and clean processes must be considered, thus having both etch and clean process optimized together has become more essential and beneficial in order to provide the optimized process solution.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.3567669