(Invited) Strain Scaling and Modeling for FETs

Stress engineering overview is given including the reasons behind its ongoing evolution. Some aspects of the stress-induced defect formation are discussed. Guidelines for avoiding such defects are proposed based on stress evolution in and around transistors during the process flow. Stress-induced pe...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Moroz, Victor, Choi, Munkang
Format: Tagungsbericht
Sprache:eng
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Beschreibung
Zusammenfassung:Stress engineering overview is given including the reasons behind its ongoing evolution. Some aspects of the stress-induced defect formation are discussed. Guidelines for avoiding such defects are proposed based on stress evolution in and around transistors during the process flow. Stress-induced performance is addressed with the focus on conversion of stress-enhanced mobility into stress-enhanced on-state current. FinFET-specific stress engineering is analyzed as well as the stress vs capacitance trade-offs. Usage of simulation tools for optimization of various stress-related design trade-offs is demonstrated. It is concluded that it is a pursuit of beneficial stress patterns that improve transistor performance without creating defects and increasing variability that defines evolution of stress engineering techniques.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.3487531