Characterization of Silicon-on-Glass Substrates Using Variable Angle Spectroscopic Ellipsometry

Development of a measurement technique for non-destructive characterization of a new silicon-on-glass (SiOG) substrate is presented. Optical constants for the multi-layer substrate are measured and analyzed, and challenges related to measurement of a transparent substrate are addressed. A formalized method of extracting key layer properties and thicknesses is demonstrated. The technique yields thicknesses for two critical layers, silicon crystallinity, and the dispersion properties of the substrate glass. Flexibility to measure variations in substrate fabrication is also demonstrated.