Enabling Technology in Thin Wafer Dicing

Driven by IC packaging and performance requirements, the die separation process is facing three main trends: Thinner wafers, stronger die and non-Silicon materials. Memory capacity increase, multichip functions and continuous package miniaturization require ultra thin wafer dicing. For IC performance increases, low-K material and other materials (top layers and even substrates) require different dicing methods for efficient and delamination free dicing processes. It is demonstrated that conventional blade dicing has reached the end of its capabilities and does not meet the separation requirements. Particular thin wafer development and the use of Die Attach Film (DAF) have added challenges and restrictions to the dicing technologies. Laser dicing processes have developed and have become the preferred dicing technology. This paper will discuss the various laser dicing technologies introduced for the different segments and will address the specific performances. Using a multibeam laser dicing process add significant advantages to the different solutions.