Semiconductor Cleaning Technology -Past and Future

This paper first briefly reviews selected aspects of the evolution semiconductor cleaning technology underwent over the years then considers challenges it is facing as the new material systems and innovative complex device configurations are being explored by semiconductor industry. Emerging trends are identified and methods developed to assure adequate performance of wafer cleans are outlined. The technique using mixture of anhydrous HF (AHF) and alcoholic solvent is considered as an example of a process which can offer solution to various future challenges.