Bit Cost Scalable (BiCS) Flash Technology for Future Ultra High Density Storage Devices

Bit Cost Scalable (BiCS) Flash Technology for Future Ultra High Density Storage Devices

We've proposed Bit Cost Scalable (BiCS) technology which realizes a 3D multi-stacked memory array with a few critical lithography steps regardless of number of stacked layers to keep a drastically continuous reduction of bit cost. The cell array concept, fabrication process, and key features ar...

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Veröffentlicht in:ECS transactions 2009-03, Vol.18 (1), p.89-92
Hauptverfasser: Nitayama, Akihiro, Aochi, Hideaki
Format: Artikel
Sprache:eng
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Zusammenfassung:We've proposed Bit Cost Scalable (BiCS) technology which realizes a 3D multi-stacked memory array with a few critical lithography steps regardless of number of stacked layers to keep a drastically continuous reduction of bit cost. The cell array concept, fabrication process, and key features are presented.
ISSN:1938-5862
1938-6737
DOI:10.1149/1.3096433