Behavior of Copper Removal by CMP and Its Correlation to Deposit Structure and Impurity Content

Behavior of Copper Removal by CMP and Its Correlation to Deposit Structure and Impurity Content

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Veröffentlicht in:Journal of the Electrochemical Society 2008, Vol.155 (1), p.H21
Hauptverfasser: Feng, Hsien-Ping, Lin, Jeng-Yu, Cheng, Ming-Yung, Wang, Yung-Yun, Wan, Chi-Chao
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container_title Journal of the Electrochemical Society
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creator Feng, Hsien-Ping
Lin, Jeng-Yu
Cheng, Ming-Yung
Wang, Yung-Yun
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title Behavior of Copper Removal by CMP and Its Correlation to Deposit Structure and Impurity Content
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