Some factors affecting hillock formation due to PECVD processing of sputtered Al-4% Cu-1% Si films

Bibliographische Detailangaben

Veröffentlicht in:	Journal of the Electrochemical Society 1992, Vol.139 (1), p.271-275
Hauptverfasser:	MINKIEWICZ, V. J, MOORE, J. O, ELDRIDGE, J. M
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Condensed matter: structure, mechanical and thermal properties Exact sciences and technology Metals. Metallurgy Physics Solid surfaces and solid-solid interfaces Surface and interface dynamics and vibrations Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Thin film structure and morphology
Online-Zugang:	Volltext
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