Characterization of Electroplated Copper Film Using a Mixture of CuSO[sub 4] and CuSiF[sub 6] as the Electrolyte

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Veröffentlicht in:	Journal of the Electrochemical Society 2005, Vol.152 (8), p.G630
Hauptverfasser:	Wu, You-Lin, Yeh, Juin-Tsun, Cheng, Chao-Shen, Hwang, Huey-Liang
Format:	Artikel
Sprache:	eng
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doi_str_mv	10.1149/1.1940751
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source	IOP Publishing Journals
title	Characterization of Electroplated Copper Film Using a Mixture of CuSO[sub 4] and CuSiF[sub 6] as the Electrolyte
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