The effects of processing parameters in the low-temperature chemical vapor deposition of titanium nitride from tetraiodotitanium
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Veröffentlicht in: | Journal of the Electrochemical Society 1998-02, Vol.145 (2), p.676-683 |
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container_issue | 2 |
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container_title | Journal of the Electrochemical Society |
container_volume | 145 |
creator | FALTERMEIER, C. G GOLDBERG, C JONES, M UPHAM, A KNORR, A IVANOVA, A PETERSON, G KALOYEROS, A. E ARKLES, B |
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doi_str_mv | 10.1149/1.1838322 |
format | Article |
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language | eng |
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source | IOP Publishing Journals |
subjects | Chemical vapor deposition (including plasma-enhanced cvd, mocvd, etc.) Cross-disciplinary physics: materials science rheology Exact sciences and technology Materials science Methods of deposition of films and coatings film growth and epitaxy Physics |
title | The effects of processing parameters in the low-temperature chemical vapor deposition of titanium nitride from tetraiodotitanium |
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