A one-step shallow trench global planarization process using chemical mechanical polishing

A one-step shallow trench global planarization process using chemical mechanical polishing

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Veröffentlicht in:Journal of the Electrochemical Society 1997-05, Vol.144 (5), p.1838-1841
Hauptverfasser: BOYD, J. M, ELLUL, J. P
Format: Artikel
Sprache:eng
Schlagworte:
Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
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container_end_page 1841
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container_title Journal of the Electrochemical Society
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creator BOYD, J. M
ELLUL, J. P
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doi_str_mv 10.1149/1.1837687
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ispartof Journal of the Electrochemical Society, 1997-05, Vol.144 (5), p.1838-1841
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source IOP Publishing Journals
subjects Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title A one-step shallow trench global planarization process using chemical mechanical polishing
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