Tribological analysis of CMP with partial asperity contact

Tribological analysis of CMP with partial asperity contact

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Veröffentlicht in:Journal of the Electrochemical Society 2003-10, Vol.150 (10), p.G630-G637
Hauptverfasser: JENG, Yeau-Ren, HUANG, Pay-Yau, PAN, Wen-Chueh
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Sprache:eng
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Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Surface treatments
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container_end_page G637
container_issue 10
container_start_page G630
container_title Journal of the Electrochemical Society
container_volume 150
creator JENG, Yeau-Ren
HUANG, Pay-Yau
PAN, Wen-Chueh
description
doi_str_mv 10.1149/1.1602086
format Article
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ispartof Journal of the Electrochemical Society, 2003-10, Vol.150 (10), p.G630-G637
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1945-7111
language eng
recordid cdi_crossref_primary_10_1149_1_1602086
source Institute of Physics Journals
subjects Cross-disciplinary physics: materials science
rheology
Exact sciences and technology
Materials science
Physics
Surface treatments
title Tribological analysis of CMP with partial asperity contact
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